Silicon Labs to showcase IoT connectivity solutions at Embedded World

Embedded World

Silicon Labs (NASDAQ: SLAB) Silicon Labs will showcase a variety of low-power wireless connectivity solutions for smart homes, building automation, lighting, metering and other Internet of Things (IoT) applications at Embedded World 2018. Hands-on demonstrations at Silicon Labs’ Booth 4A-128 will highlight the company’s new low-power Wi-Fi portfolio, Bluetooth mesh and Bluetooth 5 software, 802.15.14 Zigbee/Thread mesh solutions, multiprotocol support for Bluetooth to sub-GHz proprietary networks, secure device-to-cloud connectivity and digital isolation technology to protect embedded systems.

Silicon Labs offers the industry’s most comprehensive wireless connectivity portfolio for the IoT in standalone and multiprotocol configurations. With 15 years of mesh networking experience and more than 100 million deployed nodes, Silicon Labs is at the forefront of bringing multiprotocol wireless solutions to market. Silicon Labs is also a leader in Bluetooth innovation, delivering ultra-small Bluetooth system-in-package (SiP) modules and SoCs that support Bluetooth LE commissioning and Bluetooth mesh connectivity.

Silicon Labs Demos at Booth 4A-128:
• Check out Silicon Labs’ new, low-power Wi-Fi technology offering a high link budget for fast data throughput and secure device-to-cloud connectivity.
• Connect to a sub-GHz network dynamically through Bluetooth LE on a smartphone and extend multiprotocol connectivity to a variety of proprietary wireless applications.
• Discover the benefits of Bluetooth mesh networking for applications like indoor positioning and see Bluetooth 5 in action with our sensor-packed Thunderboard Sense 2 demo board.
• Accelerate your 802.15.4 Zigbee/Thread mesh networking designs with Silicon Labs’ multiprotocol SoCs, development tools and reference designs.
• Discover easy-to-use cellular cloud connectivity with Silicon Labs’ EFM32 Giant Gecko MCU combined with a Digi LTE-M module.
• Learn how to protect sensitive components in embedded systems using Silicon Labs’ digital isolation technology and ultra-low-power EFM8 MCUs.

Conference Sessions:
Silicon Labs’ connectivity, security and embedded experts will deliver the following conference presentations at Embedded World (NCC Ost):

February 27
• “What Is an IoT OS?” 9:30 a.m. – 10:00 a.m., Session 03: IoT I / IoT OS & Platforms
• “How Do You Select Which IoT Protocol to Use?” Noon – 12:30 p.m., Session 03: IoT I / IoT OS & Platforms
• “Security in Manufacturing: Closing the Backdoor in IoT Products,” 2:30 p.m. – 3:00 p.m., Session 02: Hacking
• “Dotdot Unifies Legacy Device Networks,” 4:00 p.m. – 4:30 p.m., Session 04: IoT II / IoT Solutions
• “Understanding Advanced Bluetooth Angle Estimation Techniques for Real-Time Locationing,” 4:00 p.m. – 4:30 p.m., Session 09: Connectivity II Bluetooth & Energy-Harvesting

February 28
• “The IoT Requires Upgradable Security,” 11:30 a.m. – noon; Session 11 I: Securing Embedded Devices I
• “ARM Cortex-M and RTOSs Are Meant for Each Other,” 11:30 a.m. – noon, Session 13: RTOS I Basics
• “Unraveling Mesh Networking Options – Benchmarking Zigbee, Thread and Bluetooth Mesh Protocol Stacks,” noon – 12:30 p.m., Session 20: Connectivity III / 80215.4, 6Lo & Mesh

March 1
• “Debugging Live Cortex-M Based Embedded Systems,” 4:00 p.m. – 4:30 p.m., Session 34: Software Engineering VII Software Debugging

Source: iotjournal.com

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